In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as well as the signal integrity in these next-generation board-to-board (B2B) surface mount area arrays (SMAAs). Small, […]
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