Stress Testing Evaluation of Chip Aluminum Polymer Capacitors for Space Applications

Stress Testing Evaluation of Chip Aluminum Polymer Capacitors for Space Applications

This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay Brusse, NASA/SSAI during the 5th Space Passive Component Days (SPCD), […]

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