Kinetics of Moisture Sorption and Reverse Bias Degradation in Chip Tantalum Capacitors

source: ASRC Federal Space and Defense (NASA), EPCI e-Symposium

Abstract:

Exposure of chip MnO2 tantalum capacitors to humid environments might result in increased ESR, leakage currents, and first turn-on failures.  However, there is a lack of literature data on the effect of moisture on reverse bias behavior of the parts. The presence of moisture can also result in pop-corning when a high water vapor pressure develops when moisture absorbed in pores of tantalum slugs vaporizes instantly during soldering process resulting in damage to capacitors. A study of kinetics of moisture ingress to and release from active elements of capacitors would allow a better understanding of degradation mechanisms and is important for preventing failures.

 
In this work, a technique for investigation of moisture sorption and desorption in solid chip tantalum capacitors that employs tantalum slugs as a humidity sensor have been developed and kinetics of the process analyzed for different types of capacitors at temperatures from room to 125 ºC.  A model that relates diffusion characteristics of polymer cases and size of the slugs to characteristic times of moisture sorption has been developed.  A strong effect of moisture on long-term degradation of reverse bias currents in MnO2 cathode capacitors has been demonstrated and physical mechanisms discussed.

Title: Kinetics of Moisture Sorption and Reverse Bias Degradation in Chip Tantalum Capacitors

Author(s): Alexander Teverovsky
Organisation(s): ASRC Federal Space and Defense (NASA)
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 6.1.  Quality & Reliability Session., PCNS2017 Proceedings Pg.117-127
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Aerospace
e-Sessions Scope Components: Capacitors
e-Sessions Topics: Quality & Reliability


 

more 1st PCNS symposium technical papers can be viewed and downloaded in pdf from EPCI Academy e-Proceedings:

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