Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

APEC 2026 Power Electronics Trends and Implications for Passive Components

APEC 2026 Power Electronics Trends and Implications for Passive Components

Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

Würth Elektronik Releases Heat Sinks for TO and IC packages

Würth Elektronik Releases Heat Sinks for TO and IC packages

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

Modelithics Expands COMPLETE+3D Library for Ansys HFSS

Modelithics Expands COMPLETE+3D Library for Ansys HFSS

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