Mounting Techniques Overview IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main ...
Common Soldering Process Issues Oxidization Fast oxidisation is a common issue related to high temperatures and presence of oxygen during the convection reflow or ...
PCB Board Design and Handling Board Design and Component Pre-Assembly Preparation The leads of leaded components shall be bent and often cut to the right ...
Soldering, PCB Handling and Rework Soldering What is the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one ...
Thick Film Power Resistor with Thick Printed Copper Terminals source: FEE RICE University of West Bohemia Pilsen, Elceram a.s., EPCI e-Symposium Abstract: This paper is focused on the thick film ...
Temperature Dependence of Leakage Current Degradation of Tantalum Capacitors at High Electric Field source: Brno University of Technology CEITEC, AVX Czech Republic s.r.o., EPCI e-Symposium Abstract: Tantalum capacitors have been the preferred capacitor ...
Kinetics of Moisture Sorption and Reverse Bias Degradation in Chip Tantalum Capacitors source: ASRC Federal Space and Defense (NASA), EPCI e-Symposium Abstract: Exposure of chip MnO2 tantalum capacitors to humid environments might ...
Energy Harvesting is not Fiction Anymore source: Würth Elektronik eiSos GmbH, EPCI e-Symposium Abstract: Our environment is changing and everything is becoming “electronified”. Our glasses, our ...
Capacitors and Resistors with Extended Operating Temperature Range for GaN Applications– Development and Space Evaluation source: Alter Technology, ESA ESTEC, EPCI e-Symposium Abstract: During the last decade, a growing number of applications demanding higher power ...
Carbon Nanotubes Ammonia Sensor Printed by Aerosol Jet System source: RICE, FEE, University of West Bohemia in Pilsen, EPCI e-Symposium Abstract: This article deals with ammonia gas sensor based ...