This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse...
Read moreDetailsThis article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse...
Read moreDetailsThis article is based on ESA SPCD 2022 paper entitled “Miniature RF switch for compact redundancy ring” written by Olivier...
Read moreDetailsThis article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
Read moreDetailsThis article is based on ESA SPCD 2022 paper entitled “EXXELIA New MMLTM Technology for Film Capacitors Miniaturization” written by...
Read moreDetailsThis article is based on ESA SPCD 2022 paper entitled “High Energy Density Solid Stare Polymer Capacitors for Space Applications”...
Read moreDetailsThis article is an excerpt from ESA SPCD 2022 paper entitled “Miniaturization of high voltage MLCC for space applications” written...
Read moreDetailsThis article is an excerpt from ESA SPCD 2022 paper entitled “Novel Graphene Material for High Energy Storage Supercapacitors” written...
Read moreDetailsThis article is an excerpt from ESA SPCD 2022 paper entitled “Resistive and Wilkinson Power Splitters at Frequencies of Millimeter...
Read moreDetailsThis article is an excerpt from ESA SPCD 2022 paper entitled "Supercapacitors for space applications: trends and opportunities" written by...
Read moreDetailssource: KEMET Electronics Corporation; ESA SPCD 2018 Symposium EPCI e-symposium library article There is a trend to use the commercial...
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