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Imec Presents High-density MIMCAP RF interposer for III-V chiplets

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

Imec has extended its 300 mm RF silicon interposer platform with high‑density metal–insulator–metal capacitors (MIMCAPs), a scalable passive modeling framework and laser‑assisted chiplet bonding to support heterogeneous integration of III‑V chiplets Read the original post at Imec Presents High-density MIMCAP...

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