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Würth Elektronik’s new WE‑FNCS flexible nanocrystalline sheets target exactly this need by providing a thin, easy‑to‑apply magnetic shield for enclosures and wireless power systems. Nanocrystalline absorber sheets are an increasingly Read the original post at Würth Elektroniks Flexible EMI...

Hirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained mobile and wearable designs. It targets applications where every fraction Read the original post at Hirose Releases Ultra‑low Profile...

Samsung Electro-Mechanics has introduced an automotive-grade multilayer ceramic capacitor (MLCC) that combines 100 µF capacitance and 4 V rating in a 1206 (3.2 × 1.6 mm) package with X7T temperature Read the original post at Samsung Introduces Automotive 1206...

Samsung Electro‑Mechanics has introduced a dedicated silicon capacitor lineup targeting high‑performance semiconductor packages, AI servers, advanced automotive and aerospace electronics. These Samsung Electro‑Mechanics ultra‑thin silicon capacitors combine semiconductor processing with Read the original post at Samsung Presents Ultra‑Thin Silicon...

YMIN presents hybrid aluminum electrolytic capacitors from its VHT series as bulk and output filtering options for LiDAR power stages, particularly where designers are evaluating alternatives to MLCC arrays. Automotive Read the original post at YMIN Hybrid Aluminum Capacitors...

TrendForce’s latest MLCC industry research reveals that the AI arms race among global cloud service providers (CSPs) is driving demand towards a select few high-end MLCC specifications. This concentration of Read the original post at TrendForce: CSP in‑house AI...

Sumida has introduced the WMT1513T150/DS family of AEC‑Q200 qualified SMD metal inductors aimed at high‑reliability automotive DC/DC converter stages. These magnetically shielded high current power inductors combine soft saturation behaviour, Read the original post at Sumida Introduces SMD Metal...

Imec has extended its 300 mm RF silicon interposer platform with high‑density metal–insulator–metal capacitors (MIMCAPs), a scalable passive modeling framework and laser‑assisted chiplet bonding to support heterogeneous integration of III‑V chiplets Read the original post at Imec Presents High-density MIMCAP...

Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for harsh automotive powertrain environments. It targets BEV/HEV inverters, converters, onboard Read the original post at Hirose Releases 0.5 mm Floating...

YAGEO Group’s SMP253 series is a surface‑mount Y2 safety metallized paper capacitor family rated 310 VAC for line‑to‑earth EMI suppression in industrial and automotive power electronics. The new YAGEO Y2 Read the original post at YAGEO Introduces 310VAC SMD...