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Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc. This marks a major milestone in Molex’s Read the original post at Molex Completes Acquisition of...

The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial automation, and robotics. While most headlines focus on wide‑bandgap semiconductors Read the original post at APEC 2026 Power Electronics...

Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that combines the advantages of traditional oil impregnation with those of Read the original post at Hydra Enhances Film Capacitor...

Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages and ICs with flat surfaces. The new WE-HTO, WE-HTOI, WE-HIC Read the original post at Würth Elektronik Releases Heat...

Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding, the parent company of MRS Electronic. The transaction brings together two long-standing partners and Read the original post at Würth Elektronik ICS to...

India has approved 29 new projects under the Electronics Components Manufacturing Scheme (ECMS), unlocking investments of around ₹71.0 billion, i.e. roughly US$751 million to expand domestic electronics production and strengthen the Read the original post at Indias ECMS Wave Brings...

Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain relief, and handling in dynamic industrial applications. The concept targets Read the original post at Binder Introduces Triangular Moulding...

Samsung Electro-Mechanics has introduced a set of MLCC ceramic capacitors aimed at 35 V class medium-voltage nodes and flying capacitor roles in high-efficiency charge pump circuits for super-fast smartphone charging. Read the original post at Samsung Introduces 35V MLCCs...

The global electronics industry has gained a significant update to one of its key assembly-process standards with the release of the new ECIA/IPC/JEDEC J‑STD‑075B “Classification of Passive and Solid State Read the original post at New J‑STD‑075B Standard Elevates...

Modelithics has announced a major update of the Modelithics COMPLETE+3D Library v26.0. for Ansys HFSS simulation software, which is now part of the Synopsys portfolio. The latest Modelithics release introduces Read the original post at Modelithics Expands COMPLETE+3D Library...