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Power electronics teams entering 2026 face tighter space, efficiency and time‑to‑market constraints, while magnetics must still behave predictably across thermal and frequency extremes. This webinar from Frenetic’s first 2026 series Read the original post at 2026 Power Magnetics Design...

Skeleton Technologies, a global leader in mission-critical power solutions, is expanding its presence in the United States to support the rapid growth of AI data centers and the resulting strain Read the original post at Skeleton Technologies Expands in...

SCHURTER has introduced a new series of 5.5V coin cell supercapacitors designed as compact energy storage elements for low‑voltage electronics. These SCHURTER supercapacitor devices target engineers who need fast charge/discharge Read the original post at SCHURTER Releases Coin Cell...

TDK has introduced the B3271xP series of DC link film capacitors aimed at demanding automotive and industrial power electronics operating up to 125 °C. The series targets engineers who need Read the original post at TDK Unveils 125C Compact...

Empower Semiconductor has introduced a new generation of embedded silicon capacitors (ECAPs) aimed at improving power delivery networks in high‑current AI and high‑performance computing (HPC) processors. The silicon capacitor devices Read the original post at Empower Releases High-Density Embedded...

Schurter’s EKO series is a new family of square‑body high‑voltage fuses designed for DC and AC power systems up to 1000 VDC and, for selected variants, 1250 VAC. They target Read the original post at Schurter Releases EKO HV...

Würth Elektronik has reworked its SMT spacer portfolio to use lead‑free alloys and added new assembly options targeted at high‑volume SMT production. The changes give design and manufacturing teams a Read the original post at Würth Elektronik Introduces Lead-Free...

Vishay’s new RCA‑SR e3 series are AEC‑Q200 qualified thick film chip resistors designed for sulfur‑rich and thermally demanding environments in automotive, industrial, and telecom electronics. By combining proven sulfur resistance Read the original post at Vishay Releases Sulfur‑Resistant Chip...

TDK has introduced the FS1525, a new member of its µPOL non‑isolated DC‑DC power module family delivering 25 A per module in a very low‑profile package. The device targets high‑current, Read the original post at TDK Releases Stackable µPOL...

Researchers at TU Wien have developed a high‑aspect‑ratio superconducting vacuum gap capacitor NEMS structure with plate distances down to just 32 nm, setting a new benchmark for nano‑scale parallel‑plate capacitor Read the original post at TU Wien Sets New...