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KYOCERA AVX has expanded its series of MIL‑PRF‑32535 base metal electrode (BME) NP0 multilayer ceramic capacitors (MLCCs) qualified by the Defense Logistics Agency (DLA) and listed in the Qualified Products Read the original post at KYOCERA AVX MIL-PRF-32535 BME...

The Vishay Sfernice WLKN‑000 is a 2‑way Wilkinson power divider / combiner designed for 15 GHz to 20 GHz RF front ends in aerospace, defense, automotive, and high‑frequency connectivity applications. Read the original post at Vishay Releases 2-Way Wilkinson...

This work by Vladimir Azbel Ph.D. Semiconductor Process Reliability Engineer Consultant, presents an AI-assisted framework for structural diagnostics and physics-based reliability interpretation of sintered tantalum capacitor anodes based on stress–strain Read the original post at AI-Assisted Structural Diagnostics and...

The new SCF76X series from YAGEO Group is a family of three‑phase common mode chokes for high‑current EMI suppression in industrial and infrastructure power electronics. These YAGEO components are intended Read the original post at YAGEO Introduces EMI Suppression...

Exxelia has released two updated catalogues dedicated to RF and microwave design, covering microwave materials and frequency tuning components for applications up to the millimeter‑wave range. The new Exxelia documents Read the original post at Exxelia Releases Updated Microwave...

Coilcraft releases KTA5050 series family of molded, shielded power inductors with ultra‑low inductance values optimized for modern low‑voltage, high‑current DC‑DC converters in compact 5.6 × 5.2 × 5.0 mm packages. Read the original post at Coilcraft Unveils Molded Power...

Murata has started mass production of seven new AEC‑Q200 automotive MLCCs that claim world‑leading capacitance for their rated voltage and case size. These Murata MLCC capacitors target space‑constrained ADAS, autonomous Read the original post at Murata Automotive MLCCs Push...

TDK has introduced the MAF0603GWY series of ultra‑small noise suppression filters for audio lines in compact consumer devices such as smartphones and wearables. These components address the growing challenge of Read the original post at TDK Releases Ultra‑small EMI...

Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and where automated assembly is critical. They provide gold‑plated, washable contacts Read the original post at Littelfuse Presents Ultra-Miniature Half-Pitch...

SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic 2.54 mm packages are difficult to fit. They combine a Read the original post at SCHURTER Releases Compact SMT...