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TAIYO YUDEN has introduced the HVX (-K) and HTX (-K) series of conductive polymer hybrid aluminum electrolytic capacitors qualified to AEC‑Q200 for demanding automotive power electronics. These hybrid aluminum electrolytic Read the original post at TAIYO YUDEN Introduced Hybrid...

This overview article summarizes the global MLCC market in Q2/2026, outlines the roles of major manufacturers across Japan, Korea, Taiwan, China, Europe/US, and explains the key technology trends and AI Read the original post at MLCCs in the Age...

Vishay Intertechnology has introduced six new SMD polymer PTC series that target USB‑C, PoE, battery‑powered devices, and industrial automation where fast trip behavior and low series resistance are increasingly important Read the original post at Vishay Introduces SMD Polymer...

Passive Components Blog has published its AI Hardware Passive Components Dossier 06/26 technical and market report. It is a compact, high‑information, architecture‑focused study of how AI hardware designs influence and Read the original post at AI Hardware Demand for...

ECIA’s latest Industry Pulse survey reports that the June 2026 electronic components Market Sentiment Index (MSI) hit a five‑year high, signaling broad-based optimism across the authorized supply chain. At the Read the original post at ECIA Industry Pulse June...

YAGEO is implementing a broad, cross-portfolio capacitor price increase effective July 1, 2026, with official list prices up around 50% and even sharper moves in the spot market. Price increases Read the original post at YAGEO Announces July 2026...

YAGEO Group’s SCF‑X and SCT‑X single‑phase common mode chokes are EMI filter components for industrial power systems that must meet stringent EMC requirements without sacrificing efficiency or board space. The Read the original post at YAGEO Presents Single-Phase Common...

This article, edited from original article by Mark Laps, MLCC specialist at YAGEO Group, reviews why the industry is converging on 800 V DC distribution and how dedicated high-voltage C0G Read the original post at Enabling the 800 V...

binder is introducing printed electronics directly on three‑dimensional connector and device components, allowing sensors, heaters and conductor tracks to be integrated into the surface rather than added as separate assemblies. Read the original post at binder Prints Electronics on...

Edgewater Research’s latest IP&E update indicates that the broad-based recovery across the market is still gaining traction, with Agentic AI now providing an additional driver of expansion for the overall Read the original post at June 2026 Interconnect, Passives...