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Fischer Connectors has brought its world-renowned Swiss engineering expertise to the universal USB-C standard. Its Ratchet Locking USB-C Connector System provides unmatched resistance to vibration and shock. The Fischer UltiMate™ Read the original post at Fischer Releases High Vibration...

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, released the TLSM Series Tactile Switches for surface-mount technology (SMT). Designed with an exceptional lifespan of up to 2 Read the original post at Littelfuse Unveils High-Use Tactile...

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new CP2816 Series integrated thin film (ITF) high-directivity Read the original post at KYOCERA AVX Releases Compact...

The ECIA North American sales sentiment survey reported actual results of tariffs impact to sales sentiment that crush original positive outlook for April 2025. The U.S. has announced comprehensive and punitive tariffs Read the original post at Tariffs Crush Sales Sentiment...

In a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have compiled a comprehensive new database of dielectric material properties. This database is Read the original post at Murata and NIMS Built...

YAGEO Group continues its expansion of the catalogue common mode choke with ER19 shape core, PGC6895NLT. Using our flat coil winding technology, vertically mounted in a planar core, PGC6895NLT offers one Read the original post at YAGEO Releases High Current...

Electronics Supply Chain Weekly Digest 5-2-25. DATAPOINT OF THE WEEK: ISM reported US mfg PMI downticked to 48.7 in April from 49.0 in March, contracting for a second straight month Read the original post at Wk 18 Electronics Supply...

This paper Solid State Polymer Multilayer Capacitors For High Temperature Application was presented by Angelo Yializis, Polycharge America Inc. USA, during the 5th Space Passive Component Days (SPCD), an International Symposium held Read the original post at Solid State Polymer Multilayer...

This paper High-Density PCB Assemblies For Space Applications: From Evaluation To Qualification was presented by Maarten Cauwe, imec and Ghent University, Belgium during the 5th Space Passive Component Days (SPCD), an International Read the original post at High-Density PCB Assemblies For...

To address AI-induced energy spikes, companies are turning into integration of supercapacitors into data center infrastructure. The rapid growth of artificial intelligence (AI) and its increasing reliance on high-powered GPUs Read the original post at Supercapacitors Emerge as a...