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Evaluating the Reliability of Miniature Array Connectors

Evaluating the Reliability of Miniature Array Connectors

In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as...

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How to Suppress Leakage Inductance in Transformer Design

How to Suppress Leakage Inductance in Transformer Design

In this blog article Pablo Blázquez, Frenetic Power Εlectronics Εngineer is exploring a key element in Transformer design: the leakage inductance! Leakage Inductance Leakage inductance is produced by the imperfect magnetic coupling Read the original post at How to Suppress Leakage...

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