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Designers selecting cores for high‑frequency power inductors often face the choice between ferrite and nanocrystalline materials, with conflicting advice on how core type affects turns count, air‑gap and overall size. Read the original post at Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
Coilcraft has introduced a family of high-current wirewound ferrite beads designed specifically for power line EMI filtering in applications that must meet CISPR 25 automotive EMC limits. These surface-mount wirewound Read the original post at Coilcraft Releases High-Current Ferrite...
Higher switching frequencies and tighter power-density targets are reshaping inductor design across server, industrial and automotive power electronics. NANOMET soft magnetic material from YAGEO KEMET addresses that shift by combining Read the original post at YAGEO Presents NANOMET Soft...
In this article, we look at how tantalum anode SSC (stress–strain characteristics) diagnostics can be used as a structural indicator in tantalum capacitors to complement DCL (direct current leakage) and Read the original post at From DCL to SSC:...
Vishay’s new 34 PHE multi-turn absolute position sensor is a ready-to-use Hall-effect module aimed at demanding motion control and displacement tracking applications. The new Vishay position sensor combines multi-turn absolute Read the original post at Vishay Unveils Multi-Turn Position...
YAGEO Group’s KH-AT Series is a family of automotive‑grade, AEC‑Q200 qualified metal oxide varistors (MOV) designed for surge protection in demanding automotive, industrial and data‑center power electronics. The YAGEO MOV Read the original post at YAGEO Introduces Automotive MOV...
The new E13 EM surface‑mount transformer series from TDK targets 500 V automotive battery systems with compact footprints, automotive qualification and insulation systems aligned with relevant IEC standards, making them Read the original post at TDK Releases Compact SMD...
High-Q RF multilayer ceramic capacitors are often compared by footprint first, but in real RF and microwave circuits the decisive parameters are ESR, Q factor, thermal endurance, voltage headroom, and Read the original post at High-Q RF & Microwave...
Molex’s new HSAutoLink G automotive Ethernet connector system targets the rapidly growing bandwidth needs in software‑defined vehicles, bringing multi‑gigabit performance up to 25 Gbps into a compact, USCAR‑compatible footprint. Designed for Read the original post at Molex Unveils Automotive Ethernet...
