The following is a list of most common soldering and mounting standards used and referred by passive component manufacturers in their mounting guide specifications:
- EIA/IPC/JEDEC J-STD-002E – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
- JESD22-B102E – Solderability
- IPC/JEDEC J-STD-020E – Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices
- IPC/JEDEC J-STD-033C– Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
- ECIA/IPC/JEDEC J-STD-075 – Classification of Passive and Solid State Devices for Assembly Processes
- BS CECC 00802 – Harmonized system of quality assessment for electronic components. Guidance document: CECC Standard method for the specification of surface mounting components (SMDs) of assessed quality
- EN NF 61192 – Workmanship Requirements For Soldered Electronic Assemblies, AFNORM
- EN 61760-1:2006 – Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
- IPC/JEDEC-EIA-625 – Requirements For Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
- IPC-2221 – Generic Standard on Printed Board Design
- IPC-SM-782 – Surface Mount Design and Land Pattern Standard
ABC of CLR: Chapter M Mounting Guidelines
List of Standards
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Acknowledgement
The presented guidelines have been prepared under ESA Contract: 40001210761/17/NL/CRS with European Passive Components Institute s.r.o. “Passive Component Support EEE331”
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