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According to article by Wu et al. from YAGEO researcher team in the International Journal of Applied Ceramic Technology, alloying nickel internal electrodes with small amounts of tin or indium significantly Read the original post at Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes
Littelfuse releases a new family of six open-loop hall-effect current sensors that delivers accurate, isolated current measurement with analog or digital outputs for next-generation electric and hybrid vehicles. Littelfuse, Inc., Read the...
Vishay Intertechnology, Inc. introduced two new series of thin film chip fuses with fast and very fast acting performance. The Vishay Sfernice S2F and S3F fuse devices are designed to ensure circuit continuity with Read the...
This article by Vladimir Azbel, an independent consultant on tantalum capacitors, discusses a mechanical testing method for distinguishing load-bearing necks from oxide-dominated regions in porous tantalum anode pellets used in Read the...
This article and video presentation by Sam Ben-Yaakov challenge conventional wisdom and reveal that the widely recommended method of adding a parallel resistor across the thermistor doesn’t actually enhance linearity Read the...
This article based on Würth Elektronik webinar presentation discusses in-depth optimizing RF signal integrity for coaxial connectors and coaxial-to-PCB interconnect. This Würth Elektronik Webinar presentation and the article provides a Read the...
SCHURTER has introduced a new fuse technology, the Pyrofuse-APO Series, designed to meet the increasing demand for reliable protection in high-voltage systems driven by electrification in industries like EVs, aerospace, and Read the...
Coilcraft Introduces 016008F Ferrite Chip Inductors in 01005 (0402) Package for Space‑Constrained RF Designs. World’s smallest wirewound ferrite SMD chip inductors deliver high performance in ultra‑compact, high‑frequency applications. Coilcraft, a Read the...
Modelithics Unveils Modelithics Qorvo GaN Library v25.5.9 with Enhanced Compatibility and New Non-Linear Models. Modelithics®, a leading provider of innovative and high-quality custom modeling and measurement services for RF, microwave, Read the...
Bourns has released the BTJ Series thermal jumper chips, a family of surface‑mount thermal links designed to move heat efficiently while maintaining electrical insulation between circuit nodes. These components target Read the original post at Bourns BTJ Thermal Jumper Chips for PCB Heat Management
This article and presentation by Sam Ben-Yaakov describes one-pulse nonlinear-inductor measurement method that provides a compact way to extract nonlinear magnetic properties of power inductors, crucial for accurate design of Read the original post at One‑Pulse Characterization of Nonlinear Power Inductors
Samsung Electro-Mechanics has introduced the world’s first CLLC resonant multilayer ceramic capacitor (MLCC) in a compact 1210 (3.2 × 2.5 mm) package, offering 33 nF at 1000 V with a Read the original post at Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size
Bourns® introduced PF-SRC50E fuse series offering a compact high-voltage protection solution that complies with UL 248-13 and IEC 60269-4 (aR class) standards for safety and reliability. Bourns, Inc., a leading Read the original post at Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors
As AI servers and GPU accelerators push to higher performance and power density, their power delivery networks are undergoing a major architectural shift. Designers are increasingly replacing aluminum polymer capacitors Read the original post at Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems
