Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and where automated assembly is critical. They provide gold‑plated, washable contacts Read the original post at Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic 2.54 mm packages are difficult to fit. They combine a Read the original post at SCHURTER Releases Compact SMT DIP Switches
TDK Corporation and Nippon Chemical Industrial have formally established a joint venture focused on advanced materials and manufacturing processes for electronic components, primarily multilayer ceramic capacitors (MLCCs). TDK Corporation and Read the original post at TDK and Nippon Chemical Launch Joint Venture for MLCC Materials
Electronics Supply Chain Weekly Digest 4-3-26. DATAPOINT OF THE WEEK: S&P reported Mar Eurozone mfg PMI increased to 51.6 from 50.8 in Feb, reaching another 4 year high and is in Read the original post at Wk 14 Electronics Supply Chain Digest
Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6 × 0.8 mm package for space‑constrained power stages in portable, Read the original post at Bourns Releases Compact High Current Shielded Power Inductors
Edgewater Research’s IP&E report indicates that the recovery trend continued to strengthen through the end of 1Q, with book-to-bill ratios moving higher. Meanwhile, the debate over optical versus copper interconnects Read the original post at March 2026 Interconnect, Passives and Electromechanical Components Market Insights
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc. This marks a major milestone in Molex’s Read the original post at Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial automation, and robotics. While most headlines focus on wide‑bandgap semiconductors Read the original post at APEC 2026 Power Electronics Trends and Implications for Passive Components
Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that combines the advantages of traditional oil impregnation with those of Read the original post at Hydra Enhances Film Capacitor Robustness by Novel Gel Filler
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages and ICs with flat surfaces. The new WE-HTO, WE-HTOI, WE-HIC Read the original post at Würth Elektronik Releases Heat Sinks for TO and IC packages
