Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6 × 0.8 mm package for space‑constrained power stages in portable, Read the original post at Bourns Releases Compact High Current Shielded Power Inductors
Edgewater Research’s IP&E report indicates that the recovery trend continued to strengthen through the end of 1Q, with book-to-bill ratios moving higher. Meanwhile, the debate over optical versus copper interconnects Read the original post at March 2026 Interconnect, Passives and Electromechanical Components Market Insights
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc. This marks a major milestone in Molex’s Read the original post at Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial automation, and robotics. While most headlines focus on wide‑bandgap semiconductors Read the original post at APEC 2026 Power Electronics Trends and Implications for Passive Components
Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that combines the advantages of traditional oil impregnation with those of Read the original post at Hydra Enhances Film Capacitor Robustness by Novel Gel Filler
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages and ICs with flat surfaces. The new WE-HTO, WE-HTOI, WE-HIC Read the original post at Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding, the parent company of MRS Electronic. The transaction brings together two long-standing partners and Read the original post at Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio
India has approved 29 new projects under the Electronics Components Manufacturing Scheme (ECMS), unlocking investments of around ₹71.0 billion, i.e. roughly US$751 million to expand domestic electronics production and strengthen the Read the original post at Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain relief, and handling in dynamic industrial applications. The concept targets Read the original post at Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Samsung Electro-Mechanics has introduced a set of MLCC ceramic capacitors aimed at 35 V class medium-voltage nodes and flying capacitor roles in high-efficiency charge pump circuits for super-fast smartphone charging. Read the original post at Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging
