Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging where thermal management, alignment accuracy, and high frequency signal integrity Read the original post at Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in harsh environments. The latest design update from binder adds a Read the original post at binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear, reliable haptic feedback. It combines a tiny footprint with selectable Read the original post at SCHURTER Releases SMT Micro Switch for Compact HMIs
YAGEO introduces VW80808 automotive grade multilayer ceramic capacitors (MLCCs) with flexible terminations and C0G dielectric designed for high‑reliability operation in demanding automotive environments. They target applications where vibration, board flex Read the original post at YAGEO Introduces C0G Flexible Termination Automotive MLCCs
Fringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components. Jonas Mühlethaler, CTO at Frenetic, presented a detailed methodology for Read the original post at Modeling Fringing Field Losses in Inductors & Transformers
Murata has introduced a discrete timing solution that combines a high‑precision crystal unit with an external NTC thermistor to meet the tight timing accuracy requirements of automotive Ultra Wide Band Read the original post at Murata Introduces Crystal and NTC Set for Automotive UWB Timing
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ASICs used in data center and high‑performance compute infrastructure. The Read the original post at Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range specifically targeted at power‑loss protection (PLP) circuits in new EDSFF and ultra‑thin U.2 SSDs. These Read the original post at YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression (TVS) diodes designed for automotive power electronics. These Littelfuse AEC-Q101 qualified over-voltage protection devices offer Read the original post at Littelfuse Expands High-Voltage TVS Diodes
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new stocking parts and nearly one hundred new suppliers to support faster prototyping and time-to-market. DigiKey Read the original post at DigiKey Adds 31k New In‑Stock Parts in Q1 2026
