Tag: passive components

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a wider range of RF and microwave designs that need stable inductance and predictable RF behavior without the Read the original post at Knowles Expands High‑Q Ceramic Core Inductors for RF designs

Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

Hirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained mobile and wearable designs. It targets applications where every fraction Read the original post at Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

Samsung Electro‑Mechanics has introduced a dedicated silicon capacitor lineup targeting high‑performance semiconductor packages, AI servers, advanced automotive and aerospace electronics. These Samsung Electro‑Mechanics ultra‑thin silicon capacitors combine semiconductor processing with Read the original post at Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

YMIN presents hybrid aluminum electrolytic capacitors from its VHT series as bulk and output filtering options for LiDAR power stages, particularly where designers are evaluating alternatives to MLCC arrays. Automotive Read the original post at YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

TrendForce’s latest MLCC industry research reveals that the AI arms race among global cloud service providers (CSPs) is driving demand towards a select few high-end MLCC specifications. This concentration of Read the original post at TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

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