Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ASICs used in data center and high‑performance compute infrastructure. The Read the original post at Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range specifically targeted at power‑loss protection (PLP) circuits in new EDSFF and ultra‑thin U.2 SSDs. These Read the original post at YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression (TVS) diodes designed for automotive power electronics. These Littelfuse AEC-Q101 qualified over-voltage protection devices offer Read the original post at Littelfuse Expands High-Voltage TVS Diodes
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new stocking parts and nearly one hundred new suppliers to support faster prototyping and time-to-market. DigiKey Read the original post at DigiKey Adds 31k New In‑Stock Parts in Q1 2026
Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers who need both pulse handling and filtering performance in space‑constrained electronics. These Exxelia MICA capacitor Read the original post at Exxelia Introduces SMD High‑Voltage Mica Capacitors
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the intricate process of miniaturizing tantalum capacitors, exploring the challenges and underlying physics involved. Tantalum capacitors Read the original post at Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids in heat dissipation. Combining them with thermal materials achieves optimal Read the original post at Heatsink Design and Thermal Interface Materials for Reliable Electronics
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material while increasing packing density in SMT production. The Murata concept Read the original post at Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
Electronics Supply Chain Weekly Digest 4-24-26. DATAPOINTS OF THE WEEK: March new car registrations in Europe totaled 1.58, surpassing the 1M mark for first time since December, and up 11.1% Y/Y and Read the original post at Wk 17 Electronics Supply Chain Digest
Modelithics has released version 26.1 of its Modelithics COMPLETE Library for Keysight Advanced Design System (ADS), extending high‑accuracy RF and microwave models for passive components, active devices and system‑level parts. Read the original post at Modelithics Releases COMPLETE v26.1 for Keysight ADS
