Tag: passive components

Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive

Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive

Würth Elektronik has introduced the WE-SFIA series of SMT flat-wire inductors in compact 2010, 2013, and 2016 packages aimed at high-efficiency power conversion in automotive electronics. The combination of Würth Read the original post at Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive

KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

KYOCERA AVX has extended its TransGuard VT Series of multilayer varistors (MLVs) with new versions optimized for 48V automotive power supply systems in electric and hybrid vehicles, light e‑mobility, and Read the original post at KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

YAGEO Introduces C0G Flexible Termination Automotive MLCCs

YAGEO Introduces C0G Flexible Termination Automotive MLCCs

YAGEO introduces VW80808 automotive grade multilayer ceramic capacitors (MLCCs) with flexible terminations and C0G dielectric designed for high‑reliability operation in demanding automotive environments. They target applications where vibration, board flex Read the original post at YAGEO Introduces C0G Flexible Termination Automotive MLCCs

Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging where thermal management, alignment accuracy, and high frequency signal integrity Read the original post at Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in harsh environments. The latest design update from binder adds a Read the original post at binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

SCHURTER Releases SMT Micro Switch for Compact HMIs

SCHURTER Releases SMT Micro Switch for Compact HMIs

The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear, reliable haptic feedback. It combines a tiny footprint with selectable Read the original post at SCHURTER Releases SMT Micro Switch for Compact HMIs

Modeling Fringing Field Losses in Inductors & Transformers

Modeling Fringing Field Losses in Inductors & Transformers

Fringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components. Jonas Mühlethaler, CTO at Frenetic, presented a detailed methodology for Read the original post at Modeling Fringing Field Losses in Inductors & Transformers

Murata Introduces Crystal and NTC Set for Automotive UWB Timing

Murata Introduces Crystal and NTC Set for Automotive UWB Timing

Murata has introduced a discrete timing solution that combines a high‑precision crystal unit with an external NTC thermistor to meet the tight timing accuracy requirements of automotive Ultra Wide Band Read the original post at Murata Introduces Crystal and NTC Set for Automotive UWB Timing

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ASICs used in data center and high‑performance compute infrastructure. The Read the original post at Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range specifically targeted at power‑loss protection (PLP) circuits in new EDSFF and ultra‑thin U.2 SSDs. These Read the original post at YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

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