This paper High Energy Density Supercapacitors for Space Applications: A Leap Forward in Space Exploration Energy Systems was presented by Victoria Manzi-Orezzoli, Swistor SA, Switzerland during the 5th Space Passive Component Read the original post at High Energy Density Supercapacitors for Space Applications
binder introduces new M12 L- and T-coded connectors featuring stainless steel locking mechanisms, ensuring the highest levels of reliability and durability in demanding industrial environments. With the launch of the Read the original post at binder Releases M12 Robust Stainless Steel Locking L- and T-coded Connectors
This article explain in depth impact of magnetic field and how to effectively shield it. The post is based on Würth Elektronik‘s “Reference Guide ABC of Shielding” that can be ordered Read the original post at Magnetic Shielding and Magnetic Shielding Sheets
This article explains shielding cabinet function, operation and effectiveness. The post is based on Würth Elektronik‘s “Reference Guide ABC of Shielding” that can be ordered from WE website here. Published under permission Read the original post at Shielding Cabinets
This paper CAD-to-FAB: an introduction to the recent and ongoing investment in the capability to produce, at scale a variety of planar RF passive structures was presented by Alan Mc Read the original post at CAD-to-FAB Capability to Produce Planar RF Passive Structures
Würth Elektronik is excited to announce the launch of the SN6507 Development Kit , featuring the Texas Instruments (TI) SN6507EVM and WE transformer line. This comprehensive solution is designed to Read the original post at Würth Elektronik Offers New Power Supplies Development Kit
Bourns adds four product series to its shielded power inductor portfolio. The new power inductors feature high heating/saturation current and low magnetic field radiation. Bourns, Inc., a prominent manufacturer and Read the original post at Bourns Extends Shielded Power Inductors by Four New Series
This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay Brusse, NASA/SSAI during the 5th Space Passive Component Days (SPCD), Read the original post at Stress Testing Evaluation of Chip Aluminum Polymer Capacitors for Space Applications
This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler, TDK, Austria during the 5th Space Passive Component Days (SPCD), an Read the original post at 3D Printing of Passive Components from Manufacturer Perspective
This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin Nicolle and Alexandre Moulin, VISHAY Sfernice SA, France during the 5th Space Read the original post at Characterization of 70GHz Thin Film Chip Resistors
