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Airbus Defence and Space Roadmap for Passive Components

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      Airbus Defence and Space Roadmap for Passive Components

      September 26, 2019
      Reading Time: 4 mins read
      10 0
      A A

      source: ADS; ESA SPCD 2018 Symposium

      EPCI e-symposium library article

      Airbus Defence and Space Roadmap presentation by Laurent Toudret during the ESA SPCD 2018.

      published by EPCI under approval of ESA SPCD 2018 organizing committee.


      Title: Airbus Defence and Space Roadmap for Passive Components
      Author(s): Laurent Toudret
      Organisation(s): Airbus Defence and Space
      Symposium: ESA SPCD 2018
      Reference: Technology Roadmaps
      ISBN: N/A
      e-Sessions Applications: Aerospace
      e-Sessions Scope Components: Capacitors, Inductors
      e-Sessions Topics: Quality & Reliability, Roadmaps


      Key Ideas from the Last SCPD 2013 and 2016

      • SCPD-2013 Overview of passive components used in space:~80% of total components
      • Trend for the future: Miniaturisation
      • Lower supply voltage for IC, high frequency operation, high temperature operation, higher power for RF connectors
      • Need to be competitive for European manufacturers
      • Design for ManufacturingGoal: 100% of part in automatic assembly
      • Passive part assembly qualification are critical
      • Major trends VLSI like FPGA: lower supply voltage, higher operating frequency, many decoupling capacitors
      • Waiting for GaNFET for DC-DC converter
      • High data-rate interface
      • RF domain: 27-31 GHz parts are increasing, development for Q/V band running, rated power increase, connectors comes to their limits.
      • Technology Status in Europe. The needs expressed by the space industry are almost covered with ESA qualified and/or evaluated components with the support of national agencies (CNES DLR)
      • Some missing components: chip ceramic BME in 0402, multi-anode polymer tantalum capacitors, high voltage relays, high efficient SMD magnetics 

      All remarks from the two first SCPD are still valid:

      • Lower size
      • Higher performance
      • Higher frequency
      • Higher power to be managed
      • Lower cost

      What is new in 2018:

      • We face a huge increase of data traffic
        • Exponential trend for global data traffic and mobile data 
        • More and more Machine-to-Machine exchange (x8 in 5 years) and mobile service 
      • Consequences for Data Exchange in Space
        • Move from RF to Optical Link between ground and satellites, between satellites LEO-to-GEO, LEO-to-LEO
        • Wide increase of data to be processed on board
      • In parallel, there are major evolutions in data processing 
        • From system in box to system-on-chip
        • Mix of electronics: digital, power, RF signal interface to be managed in the same area
        • Applications: Frequency Conversion, Signal Processing, Data Compression, Signal/ Data Security/Encryption, Data Storage, Telemetry and Control

      Consequences for Electronics

      • Voltage Power Supplies for SoC
        • Number of power supplies
        • Due to the high number of different functions and interface types, more and more different supply voltages will have to be managed separately
        • Multiplication of Point-of-Load and Low-Drop-Out regulator
      • Increase of Electromagnetic Compatibility constraints
        • Low voltage and High current: down to 0.8V >10A, supplied by a DC-DC converter (several 100kHz)
        • High frequency interface: 25GHz, even more in a near future
        • DRR3/4 memories: high data-rate exchange
        • Low voltage data monitoring for the supply currents 

      Consequences for passive parts

      • Decoupling capacitor for FPGA and SoC can have a major impact on surface
        • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
        • In addition, large capacitance, low voltage and low ESR: tantalum, polymer multi-anode
      • Supply voltage functions:
        • point-of-load and low drop-out voltage regulator
        • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
        • In addition, large capacitance, low voltage, tantalum, polymer, multi-anode (but ESL could be a limit with high-frequency switching operations)
        • High current inductors
        • Shunts are mandatory for overload protection 
      • Module interconnection
        • Very high-frequency connector (from 6 to 25 Gb/s up to 50Gb/s) with many channels in parallel, press-fit or BGA technology
      • EMI management
        • Introduction of 0402 RF inductors
        • Introduction of Chip ferrite beads for power applications 

      New Space

      Advantage of automotive components:

      • Example with chip ceramic capacitor
        • Cost: Between ESA and Automotive: x400, Between COTS+ and Automotive:x100
      • Miniaturization
      • Can be mandatory: due to radiation issue, replacement of IC by discrete solution requiring more space
      • Example with ceramic chip capacitor:
        • size Comparison from a manufacturer supplying capacitors from commercial to full qualified ESA and MIL, including BME techno: for 1210 size 50V, from 0.1μF in MIL qualified to 1μF in ESA BME, up to 10μF in automotive
      • Continuous production quality survey and improvement

      Drawbacks of Automotive components:

      • Assembly qualification (To be assessed like all components)
      • Mechanical vibrations (But qualified through the assembly qualification)
      • Out-gassing (To be assessed, especially for inductors, transformers, connectors)
      • Long term operation (But not on the lot)
      • Early failure rate (No specified screening procedure)
      • Lack of lessons learned in space mission

       

      … see more at the full presentation link below…

       


      see the full presentation here:

       

       

       

       


       

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