Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology

Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology

Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the Read the original post Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology on Passive Components Blog.

Leveraging Thin Film on Ceramic Substrates for Interconnects and Interposers

Leveraging Thin Film on Ceramic Substrates for Interconnects and Interposers

Knowles Precision Devices blog article describes use of thin film technology on ceramic substratesfor interconnects and interposers. Innovation in advanced packaging was driven, in part, by advancements in interposer design and construction. Interposers are electronic components designed to sit within a package and connect different circuits and components via interconnects. Thin film interconnects are standard Read the original post Leveraging Thin Film on Ceramic...

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