Leading electronics manufacturer Murata has introduced multi-layer ceramic (MLCC) moulded capacitors that successfully draw on the company’s advanced resin moulding capabilities. The EVA series of MLCCs moulded capacitors have properties Read the original post Murata Unveils Compact MLCCs with Extended Creepage Distance on Passive Components Blog.
Samtec blog published interview with Ron Bishop – President of Bishop and Associates, connector industry expert, and friend of Samtec – and talked to him about what’s going on in the connector industry nowadays, and more importantly, what the future holds. Electronic OEMs, AKA Samtec’s customers, frequently ask us about the “state of the union” of Read the original post 2023 Connector Industry Market Update...
Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4. Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board Read the original post Molex Unveils First-to-Market, Chip-to-Chip 224G...
This article written by Wataru Muraoka, KYOCERA-AVX Corporation explains properties and characteristics of crystal units. Numerous devices in people‘s lives today are becoming more sophisticated. As a result, the number of crystal Read the original post Properties and Characteristics of Crystal Units on Passive Components Blog.
YAGEO expands its portfolio of high capacitance NP0 MLCC ceramic capacitors by 10nF 630V chip in small 1206 size for high power and high efficiency LLC circuits. YAGEO continues to Read the original post YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits on Passive Components Blog.
