Samtec has expanded its successful line of Edge Rate® board-to-board connectors to include a higher density mated set that is half the width of previous designs and offers a lower-profile 5 mm mated height (ERF6 & ERM6 Series). ERF6 & ERM6 Series Edge Rate® connectors support 56 Gbps PAM4 high-speed, rugged mezzanine applications for industrial, embedded vision, instrumentation Read the original post at Samtec Introduces 0.635 mm...
This podcast by Würth Elektronik explains conditions and processes how to mount through-hole components by reflow. Because of fast assembling and small sizes, designers are turning to surfance mount technology on their PCBs. Although there are still through-hole (THT) components that need to be soldered by Wave, Through-Hole Reflow (THR), allows designers to solder the Read the original post at How to Process Through-Hole...
This Würth Elektronik webinar dives into the fascinating world of miniaturization of printed circuit boards with embedded active and passive components. The efficient use of ever smaller housing volumes and tiny surfaces is becoming increasingly important. Embedding technology is the proven solution to these challenges. Find out more about the advantages and possibilities of embedding Read the original post at Miniaturization of PCBs with...
In this Würth Elektronik webinar you will learn more about PCB based power distribution units and the power connection possibilities. Practical examples will demonstrate challenges and solution of power distribution units using PCB platform. In the field of power electronics, there is always the fundamental question of how to get power to the PCB and Read the original post at PCB Based Power Distribution...
This post if based on Samtec blog article that digest needs for interconnection for AI Artificial Intelligent systems. Every element of modern life has been impacted by the rise of computing and the semiconductors that power it, but there is no aspect of computing that has caught the public imagination more that the rise of Read the original post at Interconnection for AI Devices
