This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay Brusse, NASA/SSAI during the 5th Space Passive Component Days (SPCD), Read the original post at Stress Testing Evaluation of Chip Aluminum Polymer Capacitors for Space Applications

This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin Nicolle and Alexandre Moulin, VISHAY Sfernice SA, France during the 5th Space Read the original post at Characterization of 70GHz Thin Film Chip Resistors

This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler, TDK, Austria during the 5th Space Passive Component Days (SPCD), an Read the original post at 3D Printing of Passive Components from Manufacturer Perspective

This paper on new fast lock RF interface was presented by Olivier Berenfeld, Radiall SA, France during the 5th Space Passive Component Days (SPCD), an International Symposium held from October Read the original post at Development of a New Fast-Lock RF Connector Interface up to W-Band for Space Applications

This paper on novel high energy graphene material for supercapacitors was presented by Tomas Zednicek, EPCI European Passive Components Institute during the 5th Space Passive Component Days (SPCD), an International Symposium Read the original post at Commercialization of GN3 Graphene Material as an Active Electrode for High Energy Supercapacitors