New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications

New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications

This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications” written by Bruno Zemp, SCHURTER AG, Lucern, Switzerland. The paper was presented during the 4th ESA SPCD conference at ESA ESTEC, The Netherlands 11-14th October 2022. Published under ESA SPCD organisation committee permission. INTRODUCTION This paper aims to introduce a novel hermetically sealed...

Polysulfate Film Capacitors Pose to Extend Temperature and Energy Density of Film Capacitors

Polysulfate Film Capacitors Pose to Extend Temperature and Energy Density of Film Capacitors

Researchers at the Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) and Scripps Research have now developed a new polymer-based polysulfate dielectric material ready for film capacitors that efficiently Read the original post Polysulfate Film Capacitors Pose to Extend Temperature and Energy Density of Film Capacitors on Passive Components Blog.

TDK Releases Industry’s Highest Rated Current Chip Beads for Automotive Power Supply EMC Compliance

TDK Releases Industry’s Highest Rated Current Chip Beads for Automotive Power Supply EMC Compliance

TDK offers industry’s highest rated current multilayer chip bead for automotive power supply lines to comply with EMC requirements. TDK Corporation has announced the introduction of its new MPZ2520SPH Series Read the original post TDK Releases Industry’s Highest Rated Current Chip Beads for Automotive Power Supply EMC Compliance on Passive Components Blog.

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