HARTING, a global leader in connector and interconnect technology partnered with Altium unlock the full potential of 3D-Circuits PCB design. The relentless miniaturization trend in electronics presents a constant challenge: cramming ever-more functionality into ever-shrinking devices. Traditional Printed Circuit Boards (PCBs) are reaching their physical limitations, forcing engineers to seek innovative solutions. The 3D-Circuits technology, Read the original post at HARTING and Altium Revolutionized...

Exxelia, global manufacturer of complex passive components and subsystems introduces groundbreaking innovations in smart magnetics technology, specifically tailored for resonant bidirectional power converters. These advancements are set to redefine efficiency Read the original post at Exxelia Smart Magnetics Enhancing Next-Generation Resonant and Bidirectional Power Converters

ESA ESTEC is pleased to announce online program and registration of the 5th edition of the Space Passive Component Days (SPCD) that will take place at ESA/ESTEC, Noordwijk, The Netherlands from 15th Read the original post at ESA SPCD 2024 Program Announced and Registration Opens

This blog post was written by Philip Lessner, Chief Technology Officer at YAGEO Group and posted on his LinkedIn profile AI – Why Now?. The latest AI tools can answer Read the original post at Phil Lessner, YAGEO CTO on Artificial Intelligence – Why Now?

In this Würth Elektronik webinar we will offer you insights into HDI PCBs for Harsh Environments: What influences does a PCB see during use? Which design decisions often have a serious impact on the robustness of an HDI PCB? Every printed circuit board is a complex construction made from a wide variety of materials and Read the original post at Designing and Testing HDI...