Full paper download This paper explains layer-by-layer fabrication method, where nanocomposite dielectrics are printed by successive depositions of ultra-thin layers of a room-temperature-stable polymer ink. The work explores two polypropylene-based inks in industry-friendly solvents that are then used to fabricate capacitor devices. The paper was presented by William Greenbank, Centre for Industrial Electronics, SDU University of Southern Denmark, Denmark at the 4th PCNS 10-14th September 2023, Sønderborg,...

Pasternack, anInfinite Electronics brand and a leading provider of RF, microwave andmillimeter-wave products, has announced the launch of its MIL-STD-1553connectors engineered to meet the stringent requirements of high-stakesmilitary communications, avionics and data bus systems. Developed with meticulousattention to detail, these military-standard interconnect products deliveroutstanding performance. They have undergone rigorous testing and areconsistently ready to provide excellence in every Read the original post at Pasternack Launches Rigorously Tested...

Full paper download This article presents a method for thickness reduction of polypropylene (PP) films, used as dielectric materials for capacitors, by ion irradiation, which has a direct effect on device capacitance. The paper was presented by Shova Neupane, Centre for Industrial Electronics, SDU University of Southern Denmark, Denmark at the 4th PCNS 10-14th September 2023, Sønderborg, Denmark as paper No. 4.2. Abstract Polypropylene (PP) films have...

Full paper download This paper studies NanoLamTM film capacitors' performance of key dielectric parameters as a function of temperature in the range of  -196oC to +200oC to evaluate its capability to meet the space environment operating conditions. The paper was presented by Angelo Yializis Ph.D, Polycharge America Inc, USA at the 4th PCNS 10-14th September 2023, Sønderborg, Denmark as paper No. 4.1. selected by TPC Technical Program Committee...

This Würth Elektronik webinar aim to show where the difference between calculation and measurement of PCB heat dissipation comes from, even for relatively simple assemblies. Without time-consuming thermal simulations, demanding heat dissipation of assemblies cannot solve satisfactorily. But, to what extent can simple thermal requirements on PCBs be determined with basic mathematics? How well do Read the original post at Correlation between Calculation &...