Panasonic Industry Co., Ltd. announced that it has developed the high-thermal conductive film R-2400 for multilayer circuit boards. In recent years, electric vehicles (xEVs) have become increasingly popular due to growing interest in environmental issues. To improve the energy efficiency of electric vehicles, batteries, power supply modules, and drive units have become even more powerful. Read the original post Panasonic Industry Develops High-Thermal Conductive...

Murata Manufacturing Co., has added a new DLW32SH510XF2 lineup that meets DCMR*2 Class 3*3 requirements to the automotive use chip common mode choke coil DLW32SH_XF Series for next-generation CAN FD*1 in-vehicle networking applications. Read the original post Murata Extends Chip Common Mode Choke Coil Lineup with CAN FD Compatibility on Passive Components Blog.

TDK Corporationextends its Flexield family of magnetic shielding shielding materials with the introduction of the IFQ06, offering high permeability (μ’) and low magnetic loss (μ”) designed for near-field communications (NFC) Read the original post TDK Introduces High Permeability Ultra-Thin Magnetic Shielding Sheets for NFC Applications on Passive Components Blog.

Dennis Zogbi, Paumanok Inc. publishes on TTI Market Eye outlook on integrated passive components market trends, demand and technologies. The demand for thin film integrated passive devices is on the Read the original post Integrated Passive Components Market Trend on Passive Components Blog.

European components distribution ended the first quarter of 2023 with surprisingly strong sales numbers for Semiconductors and Interconnect components while commercial passive components decreased. Semiconductors in Q1 grew by 22.9% Read the original post European Components Distribution DMASS Report Q1 2023 Availability Improvement on Passive Components Blog.