LTCC (Low Temperature Co-fired Ceramic) The use of LTCC material is gaining importance in applications in the field of communications. This is a multi-layer process used for the production of sophisticated HF components with good performance characteristics. The ceramic-based LTCC technology is an inexpensive substrate technology with which up to 50 layers are stacked on top of each other. The silver or gold conductor...
Power FLEX transformers The FLEX transformers (Figure 2.86) are especially well suited for DC-DC converters in the lower power rang. As a result of their winding structure, consisting of six individual windings each with the same number of turns, as well as the various air gaps available, the Flex transformers are very flexible in their application. Table 2.38 shows the different sizes, and Table...
xDSL Digital Subscriber Line transformers The xDSL Digital Subscriber Line transformers (Figure 2.85) are specialized line interface transformers that are designed to optimise the performance of DSL chipsets. With each chipset varying in power drive levels, impedance characteristics and signal spectrum the transformers are very much chipset dependant in their design. Fig. 2.85: DSL Digital Subscriber Line transformers DSL (Digital Subscriber Line) DSL technology...
LAN and LAN RJ45 series Ethernet transformers The LAN Ethernet transformers (Figure 2.82) are not simple transformers, but rather modules in which, depending on the number of ports for which they are suitable, at least two transformers and a certain number of current-compensated chokes are contained. Fig. 2.82: LAN transformers As the name denotes, they are designed as transformers for Ethernet networks. Ethernet is...
Five MLCC manufacturers and Continental Automotive company as user representative discussed the MLCC Class II DC BIAS & Ageing Capacitance Loss as the Hot Panel Topic during the past 2nd PCNS Passive Components Networking Symposium 10-13th September 2019, Bucharest, Romania. The observations and comments have been summarized as an "Open Letter to AEC-Q200" to follow up the topic in wider automotive industry board. Introduction...
