by Lorandt Foelkel M.Eng; Würth Elektronik eiSos presented by Paul Le Nezet at the 2nd PCNS 10-13th September 2019, Bucharest, Romania as paper 2.1. ABSTRACT The paper introduces overview of state of the art on energy harvesting. It discus what type of ambient energies are available, what are the challenges in converting (& storing) these energies into usable energy and showing examples of real...
by Stephen Oxley M.Eng C.Eng MIET, TT Electronics UK presented by S.Oxley at the 2nd PCNS 10-13th September 2019, Bucharest, Romania as paper 1.3. Abstract Film resistor technologies have come a long way since metalised glass and cracked carbon films were first offered over eighty years ago as alternatives to the bulk material approaches of wirewound and composition. Metal oxide emerged in the 1950s...
by: R. Andersson, M. Bylund, S. Krause, A. M. Saleem and V. Desmaris Smoltek AB, Gothenburg, Sweden OUTSTANDING AWARD PAPER BY PCNS ATTENDEES presented by S.Krause at the 2nd PCNS 10-13th September 2019, Bucharest, Romania as paper 1.2. Abstract Complete on-chip fully solid-state 3D integrated capacitors using vertically aligned carbon nanofibers as electrodes to provide a large 3D surface in a MIM configuration have...
By A. Yializis Ph.D., PolyCharge America Inc., Tucson, Arizona presented at the 2nd PCNS 10-13th September 2019, Bucharest, Romania as paper 1.1. The paper introduces development of NanoLamTM, solid state, polymer monolithic capacitors, comprising 1000s of nano-thick, cross-linked polymer dielectric layers. The NanoLam amorphous polymer dielectrics have an intrinsic breakdown strength >1000V/mm, can withstand temperatures >200°C and have stable capacitance and dissipation factor with...
2nd PCNS Passive Components Networking Symposium held in Bucharest, Romania on September 10-13th, 2019 was a great opportunity to meet passive components professionals and discuss with them hot topics, technical challenges, market trends, material supplies etc. related to passive components. PCNS symposium was attended by 63 participants from 13 European countries, USA and China and posed an ideal networking possibilities for designers, purchasers, application...
