Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4. Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board Read the original post Molex Unveils First-to-Market, Chip-to-Chip 224G...

This article written by Wataru Muraoka, KYOCERA-AVX Corporation explains properties and characteristics of crystal units. Numerous devices in people‘s lives today are becoming more sophisticated. As a result, the number of crystal Read the original post Properties and Characteristics of Crystal Units on Passive Components Blog.

YAGEO expands its portfolio of high capacitance NP0 MLCC ceramic capacitors by 10nF 630V chip in small 1206 size for high power and high efficiency LLC circuits. YAGEO continues to Read the original post YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits on Passive Components Blog.

Skeleton Technologies acquires former European batteries plant in Finland to increase manufacturing capacity and accelerate R&D processes. Skeleton Technologies has announced the acquisition of the assets of the bankruptcy estate Read the original post Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity on Passive Components Blog.

TDK Corporation has announced the development of “Aim,” an original AI data analysis platform, as well as its launch for internal use in April 2023, as part of an effort Read the original post TDK Enhances Efficiency of Materials Development Using Advanced AI on Passive Components Blog.