IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods - radiation, conduction, convection and condensation. In fact, all heat transfers are used in modern reflow ovens. The heat is applied from above, below, or all directions dependent on the equipment...
Oxidization Fast oxidisation is a common issue related to high temperatures and presence of oxygen during the convection reflow or wave soldering processes. The oxidisation may induce some degradation of metal surface and its environmental robustness, thus impacting the components and the electronic hardware lifetime. The level of oxidisation is depending on more factors, the second most important (after the degree of temperature itself)...
Board Design and Component Pre-Assembly Preparation The leads of leaded components shall be bent and often cut to the right length before they are mounted / soldered to the substrate. Lead cutting, bending and mounting are operations that may be hazardous if they are not performed properly. Fig.10. leaded components basic mounting rules, source: CLR HBK Components mounted to soldering terminals must be provided...
Soldering What is the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height....
source: FEE RICE University of West Bohemia Pilsen, Elceram a.s., EPCI e-Symposium Abstract: This paper is focused on the thick film power resistors with copper terminals. These terminals are manufactured by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on alumina substrate. TPC technology is predominantly used for power...
