Low Profile Solderless Flat Interconnect for Space Applications

Low Profile Solderless Flat Interconnect for Space Applications

This article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written by Nigel Kellett et. col, Axon’ Cable that was presented during the 4th ESA SPCD conference at ESA ESTEC, The Netherlands 11-14th October 2022. Published under ESA SPCD organisation committee permission. INTRODUCTION Full Paper Download With one of the most diverse ranges of ESA QPL approvals...

Connector Temperature Rise and Derating

Connector Temperature Rise and Derating

In this presentation from Würth Elektronik on Connector Temperature Rise and Derating shows how a connector is designed regarding current to avoid consequences of too high temperatures. In the second part we take care how the heat gets dissipated over Cable and PCB … including some hints. We explain also how to create a valid Read the original post Connector Temperature Rise and Derating...

Connector Temperature and Current Ratings Challenges

Connector Temperature and Current Ratings Challenges

Thermal management and temperature derating have always been something that designers have had to plan for to keep their products safe. Temperature and power are closely linked, especially when it comes to connectors. This Samtec article discusses connector temperature and current rating challenges. The Resistance Every electrical circuit has resistance. The value may be small, Read the original post Connector Temperature and Current Ratings...

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