![How to Process Through-Hole Components by Reflow Assembly How to Process Through-Hole Components by Reflow Assembly](https://i0.wp.com/inter-connection.eu/wp-content/uploads/2024/02/through-hole-components-mount-by-reflow.jpg?resize=360,180&ssl=1)
This podcast by Würth Elektronik explains conditions and processes how to mount through-hole components by reflow. Because of fast assembling and small sizes, designers are turning to surfance mount technology on their PCBs. Although there are still through-hole (THT) components that need to be soldered by Wave, Through-Hole Reflow (THR), allows designers to solder the […]
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