![Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications](https://passive-components.eu/wp-content/uploads/2023/02/chip-fuse-for-space-360x180.jpg)
This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications” written by Bruno Zemp, SCHURTER AG, Lucern, […]
Read the original post Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications on Passive Components Blog.