C1.3 LOSSES C 1.3.1 Impedance and ESR A capacitor creates in AC circuits a resistance, the capacitive reactance (Formula C1-3). There is also certain inductance in the capacitor. In AC circuits it produces an inductive reactance that tries...
C1.2 INSULATION RESISTANCE, IR Figure C1-10. Schematic of the Insulation Resistance IR in a capacitor The dielectric of a capacitor has a large area and a short length. Even if the material is a good isolator there always...
C1.1 CAPACITANCE The Capacitance is determined by, among other things, the characteristics of the dielectric material. International standards speak of the Dielectric Constant or permittivity, designated by the symbol ε. C1.1.1 Description A capacitor serves as a reservoir...
L.1 Basic principles of inductive components Magnetism The basis for understanding inductors is provided by magnetism and a few fundamental electromagnetic field laws, revealing clear and fundamental knowledge of inductorsand ferrites. The most important phenomena and laws will...
The aim of this survey is to collect and summarise mounting recommendations of publicly available information from capacitor and resistor commercial component manufacturers. The survey aim is to collect the manufacturer’s recommendations and good tips for capacitors and...
The following is a list of most common soldering and mounting standards used and referred by passive component manufacturers in their mounting guide specifications: EIA/IPC/JEDEC J-STD-002E - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires...
IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods - radiation, conduction, convection and...
Oxidization Fast oxidisation is a common issue related to high temperatures and presence of oxygen during the convection reflow or wave soldering processes. The oxidisation may induce some degradation of metal surface and its environmental robustness, thus impacting...
Board Design and Component Pre-Assembly Preparation The leads of leaded components shall be bent and often cut to the right length before they are mounted / soldered to the substrate. Lead cutting, bending and mounting are operations that...
Soldering What is the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation....
