In this post, inspired by the Samtec blog, we’ll briefly examine IPC-A-610 Class 2 and Class 3 J-lead and Gull Wing solder joints, along with their respective requirements. In the Read the original post at IPC Class 2 vs Class 3 Solder Joints Requirements Explained

This paper was presented by Julien Logette, Axon Cable France during the 5th Space Passive Component Days (SPCD), an International Symposium held from October 15th to 18th, 2024, at ESA/ESTEC Read the original post at Fast-Lock ZIF Interconnections And Connector-less Flat Cables

This paper SWAP-C Ka-Band High Power Duplexer Based on the Emerging AFSIW Technology was presented by Issam Marah, Exens-Solutions, France as joined paper with Bordeaux Institute of Technology, France during Read the original post at SWAP-C Ka-Band High Power Duplexer Based on the Emerging AFSIW Technology

This paper presents Benefits of Using High-Reliability Polymer Tantalum Capacitors. James Turner, Ph.D. KEMET YAGEO Group, presented this during the 5th Space Passive Component Days (SPCD), an International Symposium held Read the original post at The Benefits of Using High-Reliability Polymer Tantalum Capacitors

This article written by Dennis Zogbi, Paumanok Inc. published by TTI Market Eye provides an overview of costs to produce active and passive electronic components. In the global electronic component Read the original post at Costs to Produce Active and Passive Electronic Components in 2025