This blog article written by Simon Cen, KYOCERA-AVX Corporation explains DC BIAS characteristics of ceramic capacitors and its design implications. Introduction Most electrical engineers are at least familiar with the different ratings of ceramic Read the original post DC Bias Characteristics of Ceramic Capacitors on Passive Components Blog.
Dennis Zogbi, Paumanok Inc. publishes on TTI Market Eye 2023 outlook on passive components for defence electronics. The article shows electronic materials price trends for passive electronic components. DEFENSE SPENDING: Read the original post Passive Components for Defense Electronics in 2023 on Passive Components Blog.
This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications” written by Bruno Zemp, SCHURTER AG, Lucern, Read the original post Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications on Passive Components Blog.
This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications” written by Bruno Zemp, SCHURTER AG, Lucern, Switzerland. The paper was presented during the 4th ESA SPCD conference at ESA ESTEC, The Netherlands 11-14th October 2022. Published under ESA SPCD organisation committee permission. INTRODUCTION This paper aims to introduce a novel hermetically sealed...
Researchers at the Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) and Scripps Research have now developed a new polymer-based polysulfate dielectric material ready for film capacitors that efficiently Read the original post Polysulfate Film Capacitors Pose to Extend Temperature and Energy Density of Film Capacitors on Passive Components Blog.
