New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications

New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications

This article is an excerpt based on ESA SPCD 2022 paper entitled “New Generation of Wafer-Scale, Hermetically Sealed Chip Fuse for Space Applications” written by Bruno Zemp, SCHURTER AG, Lucern, Switzerland. The paper was presented during the 4th ESA SPCD conference at ESA ESTEC, The Netherlands 11-14th October 2022. Published under ESA SPCD organisation committee permission. INTRODUCTION This paper aims to introduce a novel hermetically sealed...

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