In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as well as the signal integrity in these next-generation board-to-board (B2B) surface mount area arrays (SMAAs). Small, Read the original post at Evaluating the Reliability of...

In this blog article Pablo Blázquez, Frenetic Power Εlectronics Εngineer is exploring a key element in Transformer design: the leakage inductance! Leakage Inductance Leakage inductance is produced by the imperfect magnetic coupling Read the original post at How to Suppress Leakage Inductance in Transformer Design

Würth Elektronik and STMicroelectronics jointly developed a demo using a Würth power tool. The design, which efficiently drives a low-voltage Brushless DC motor, is ideal for handheld power-tool applications. Moreover, Read the original post at STMicroelectronics and Würth Elektronik Cooperate for a High-Performance Power Tool

TAIYO YUDEN has completed the construction of manufacturing factory in Changzhou, China and office building to expand MLCC production. As part of the medium-term plan for boosting the production of Read the original post at TAIYO YUDEN Announces Completion of China Factory to Expand MLCC Production

Hirose Electric has introduced its latest breakthrough in connectivity solutions—the BM56 Series, the world’s smallest width multi-RF board-to-board connectors. This groundbreaking connector series establishes a new benchmark for compact devices that require multi-RF compatibility, delivering unmatched performance and significant space-saving benefits. The BM56 Series is designed to address the growing demand for compact connectors that can handle Read the original post at Hirose Electric Launches the...