PCNS 2019

[vc_row][vc_column][vc_column_text]

2nd PCNS Symposium 10-13th September 2019, Bucharest, Romania

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]

event location: Library of University Politehnica Bucharest, Splaiul Independeței, 313, București 060042, Romania

[/vc_column_text][vc_single_image image=”43524″ img_size=”full” alignment=”center”][vc_column_text]

Todate there is unpaid PCNS 2019 conference and exhibition fee from company Bs & T Frankfurt am Main GmbH in value of 575 EUR provided them in trust during the PCNS registration

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/2″][vc_column_text]

PCNS 2019 Visitor Statistics

  • 63 attendees from 13 countries
  • 85% EU, 10% USA, 5% Asia
  • 55% manufacturers, 33% academia, 15% end users
  • automotive, medical and space industry presence
[/vc_column_text][vc_single_image image=”43526″ img_size=”medium” alignment=”center”][/vc_column][vc_column width=”1/2″][vc_column_text]

PCNS 2019 Top Rated Programme Items

  [/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]

PCNS 2019 PROGRAMME at a Glance

[/vc_column_text][vc_single_image image=”43507″ img_size=”full” alignment=”center”][vc_column_text]

PCNS 2019 Technical Papers are published in section e-Symposium here. Or click on the link below.

 Note: The missing publications did not allowed web publishing.

 

Keynote Presentations:

Keynote 1: Passive Components – Keys to enabling Advanced Future System Designs; Ron Demcko; Technical Sales Group Manager; AVX fellow

Keynote 2: Design Challenges of Capacitors – What about downsizing, robustness and energy density for future applications?; Stephan Menzel; Product Development Manager Capacitors; Würth Elektronik eiSos

Keynote 3: Shortage of Products – Market Mechanisms and How to avoid Fake-Products; Rüdiger Scheel; VP Automotive, Murata Electronics Europe

Keynote 4: Passive Electronic Components Education in Romania – Facts and Achievements in the last 30 years; Paul Svasta, Emeritus Professor; Politehnica University of Bucharest

[/vc_column_text][/vc_column][/vc_row][vc_row vc_row_background=”” css=”.vc_custom_1572514286406{background-color: #dbdbdb !important;border-radius: 10px !important;}”][vc_column width=”1/2″][vc_empty_space height=”50px”][vc_column_text]

HOT TOPIC Panel Discussion:

MLCC Class II DC BIAS Ageing Capacitance Loss

 

white paper available here

[/vc_column_text][/vc_column][vc_column width=”1/2″][vc_empty_space][vc_single_image image=”43527″ img_size=”medium” alignment=”center”][vc_column_text]

Left to right: Paul Le Nezet Würth Elektronik; Yuki Nagoshi Murata Electronics Europe; Ladislav Vindiš Continental Automotive GmbH; Benjamin Blume Samsung Electro-Mechanics; Wilson Hayworth Kemet Electronics; Ron Demcko AVX Corporation; Tomas Zednicek EPCI

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]

Technical Papers:

1. NEW DEVELOPMENT

1.1. A Disruptive Nano-laminate Polymer Capacitor Technology for Electric Drive Applications; Angelo Yializis; POlyCharge America Inc; United States 1.2. Integrated and discrete capacitors based on carbon nanostructures with capacitance densities in excess of 350 nF/mm2; Sascha Krause; Smoltek AB; Sweden 1.3. Advances in Film Resistor Technology; Stephen Oxley; TT Electronics; United Kingdom

2. TECHNOLOGY & ROADMAPS

2.1. Energy Harvesting is not Fiction anymore; Lorandt Fölkel; Würth Elektronik eiSos; Germany 2.2. Analysis of Multi-Layer Ceramic Capacitors used in Power Distribution Networks; Marcel Manofu; Continental; Romania 2.3. Guidelines How to Downsize MLCCs Efficiently; Yuki Nagoshi; Murata; Germany 2.4. Capacitor Trends and Challenges; M. Barta and T.Zednicek; TTI Germany and EPCI Czech Rep.

3. QUALITY & RELIABILITY

3.1. COTS procurement for space mission; Denis Lacombe; ESA ESTEC; Netherlands 3.2. Most Reliable, Most Efficient and Price Effective Solid Tantalum Capacitors; Yuri Freeman and Ed Jones; Kemet; United States 3.3. Real Environment Aluminium Electrolytic Capacitor LifeTime Evaluation and Modelling; Luca Primavesi; ItelCond and Univeristy of Milano; Italy 3.4. Supercapacitor Degradation and Life-time; Vlasta Sedláková; Brno University of Technology; Czech Republic

4. MATERIALS & PROCESSES

4.1. High Bs ferrite material development for high power applications; JC Sun;Bs&T Frankfurt am Main GmbH; Germany 4.2. High efficient new Hybrid magnetic EMI filter design for Low Voltage DC distribution; Wai Keung Mo and Thomas Ebel; Centre for Industrial Electronics, University of Southern Denmark 4.3. Conductive hybrid threads and their applications; Tomas Blecha; University of West Bohemia; Czech Republic 4.4. Tin Whisker or not Whisker; Jean Edmond Le Calvé; Valeo; France 4.5. Stable and reliable tantalum supply chain; Roland Chavasse; T.I.C.; Belgium

5. MEASUREMENT & TEST

5.1. Degradation of Polymer Tantalum Capacitors during High Temperature Storage; Alexander Teverovsky; NASA/GSFC; United States 5.2. Investigation and Experimental Comparison of Magnetic Core Loss for High-Saturation Ferrite Material; Chang Wang; TU of Denmark;Denmark 5.3. Evaluation of Active Balancing Circuits for Supercapacitors; Ciprian Ionescu; Politehnica University of Bucharest, Romani

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/2″][vc_single_image image=”43504″ img_size=”medium” alignment=”right” onclick=”custom_link” img_link_target=”_blank” link=”https://epci.eu/wp-content/uploads/2019/10/PCNS19-Final-Program-Proceedings.pdf”][/vc_column][vc_column width=”1/2″][vc_single_image image=”43505″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”https://epci.eu/wp-content/uploads/2019/10/PCNS19-Final-Program-Proceedings.pdf”][/vc_column][/vc_row]